JPS54146985A - Package for semiconductor device - Google Patents

Package for semiconductor device

Info

Publication number
JPS54146985A
JPS54146985A JP5449878A JP5449878A JPS54146985A JP S54146985 A JPS54146985 A JP S54146985A JP 5449878 A JP5449878 A JP 5449878A JP 5449878 A JP5449878 A JP 5449878A JP S54146985 A JPS54146985 A JP S54146985A
Authority
JP
Japan
Prior art keywords
light transmission
sealing
assembly
frame material
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5449878A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62580B2 (en]
Inventor
Hiroshi Tsuneno
Susumu Okikawa
Katsutada Horiuchi
Wahei Kitamura
Eiji Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5449878A priority Critical patent/JPS54146985A/ja
Publication of JPS54146985A publication Critical patent/JPS54146985A/ja
Publication of JPS62580B2 publication Critical patent/JPS62580B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/50Encapsulations or containers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/1615Shape
    • H01L2924/16195Flat cap [not enclosing an internal cavity]

Landscapes

  • Non-Volatile Memory (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
JP5449878A 1978-05-10 1978-05-10 Package for semiconductor device Granted JPS54146985A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5449878A JPS54146985A (en) 1978-05-10 1978-05-10 Package for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5449878A JPS54146985A (en) 1978-05-10 1978-05-10 Package for semiconductor device

Publications (2)

Publication Number Publication Date
JPS54146985A true JPS54146985A (en) 1979-11-16
JPS62580B2 JPS62580B2 (en]) 1987-01-08

Family

ID=12972291

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5449878A Granted JPS54146985A (en) 1978-05-10 1978-05-10 Package for semiconductor device

Country Status (1)

Country Link
JP (1) JPS54146985A (en])

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57192177A (en) * 1981-05-22 1982-11-26 Hitachi Ltd Solid-state image pickup device
JPS5812478A (ja) * 1981-07-15 1983-01-24 Hitachi Ltd 固体撮像装置の製造方法
JPS5812479A (ja) * 1981-07-15 1983-01-24 Hitachi Ltd 固体撮像装置
JPS58140155A (ja) * 1982-02-16 1983-08-19 Canon Inc 固体撮像装置
JPS59140443U (ja) * 1983-03-08 1984-09-19 新光電気工業株式会社 半導体装置用透光性キヤツプ
JPS61112370A (ja) * 1984-11-07 1986-05-30 Nec Corp パツケ−ジ
US5087964A (en) * 1989-10-31 1992-02-11 Mitsubishi Denki Kabushiki Kaisha Package for a light-responsive semiconductor chip

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57192177A (en) * 1981-05-22 1982-11-26 Hitachi Ltd Solid-state image pickup device
JPS5812478A (ja) * 1981-07-15 1983-01-24 Hitachi Ltd 固体撮像装置の製造方法
JPS5812479A (ja) * 1981-07-15 1983-01-24 Hitachi Ltd 固体撮像装置
JPS58140155A (ja) * 1982-02-16 1983-08-19 Canon Inc 固体撮像装置
JPS59140443U (ja) * 1983-03-08 1984-09-19 新光電気工業株式会社 半導体装置用透光性キヤツプ
JPS61112370A (ja) * 1984-11-07 1986-05-30 Nec Corp パツケ−ジ
US5087964A (en) * 1989-10-31 1992-02-11 Mitsubishi Denki Kabushiki Kaisha Package for a light-responsive semiconductor chip

Also Published As

Publication number Publication date
JPS62580B2 (en]) 1987-01-08

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